Current Location: HOME > Capability >

                                                      Company capability index 

Project

                                technological capability

               mass production

                        sample

Product type

high precision double-

sided & multilayer PCB/FPC, 

bury blind via,aluminium base, 

ceramic PCB, inpendance

 PCB, HDI, RF PCB.

high precision double-

sided & multilayer PCB/FPC, 

bury blind via,aluminium base,

  ceramic PCB,inpendance  PCB

 HDI, RF PCB.

Material

FR-A, FPC, Aluminum, HF

(Halogen Free), Lead Free 

Compatible, High Tg

FR-A, FPC, Aluminum, HF

(Halogen Free), Lead Free 

Compatible,High Tg

 

 Layer

 

 1-32 layer

1-40 layer

 

Inner layer  width/space

 

3/3mil

2.5/2.5mil

 

Outer layer width/space

 

3/3mil

2.5/2.5mil

 

Inner layer’s thickness

 

0.1-2.0mm

0.075-3.0mm

 

Drill aperture

 

machine 0.20mm

laser 0.1mm

machine 0.15mm

laser 0.075mm

 

Depth-diameter ratio

 

12:1

16:1

 

Overall dimension

 

520-650mm

650-900mm

 

       Copper thickness 

           of inner layer

 

12-140um

12-210um

 

      Copper thickness 

          of outer layer

 

12-210um

12-210um

 

 Min width of wolder ring

 

0.13mm

0.10mm

 

 Min space of solder mask

 

0.1mm

0.08mm

 

Min soler-mask window

 

0.05mm

0.03mm

 

Finished thickness

 

0.2mm~5.0mm

0.12mm~6.0mm

 

 Shape machining precision

 

±0.1mm

±0.08mm

Surface treament

Nickel and gold plating, 

Immersion Gold, 

OSP( lead free),

peelable Adhesive, 

Hot Air Solder Leveling, 

immersion silver, immersion tin, 

plating connecting finger, 

spray connecting figure

 

Nickel and gold plating, 

Immersion Gold,

OSP( lead free), 

 peelable Adhesive, Hot Air

 Solder Leveling,

immersion silver, 

immersion  tin, 

plating connecting finger, 

spray connecting figure.

 

 

Copyright © 20010-2017 Shenzhen HuaRongXin Circuit Technology Co.,Ltd., All rights reserved.  粤ICP备1110127号